| 1. | Quasi - interfacing plated - through hole
准表面间镀覆孔 |
| 2. | Sectional specification : single and double sided printed boards with plated - through holes
有金属化孔单双面印制板分规范 |
| 3. | Capability detail specification : single and double sided printed boards with plated - through holes
有金属化孔单双面印制板能力详细规范 |
| 4. | Grading standard of quality for single and double sided printed boards with plated - through holes
有金属化孔的单双面印制板的质量分等标准 |
| 5. | Sectional specification : single and double sided printed boards with plated - through holes ; german version en 123200 : 1992
分规范.带金属孔单面和双面印制电路板 |
| 6. | Printed boards . part 5 : specification for single and double sided printed boards with plated - through holes
印制板.第5部分:具有金属化孔的单面和双面印制板规范 |
| 7. | System of quality assessment - sectional specification - rigid double - sided printed boards with plated - through holes
质量评估体系.分规范.有镀通孔的刚性双面印制板 |
| 8. | Sectional specification : single and double sided printed boards with plated - through holes ; german version en 123200 : 1992 a1 : 1995
分规范:带金属孔单面或双面印制电路板 |
| 9. | Printed wiring boards - specification for single and double sided rigid printed boards with plated - through holes
印制电路板.第5部分:带透膜孔的单面和双面印制电路板规定方法 |
| 10. | System of quality assessment - capability detail specification - rigid double - sided printed boards with plated - through holes
质量评估体系.性能详细规范.带镀通孔的刚性双面印制板 |
